Shunting YBa2Cu3O7-x Josephson Junctions and Arrays Fabricated by He-FIB

Verfasst von

Max Pröpper, Marc André Tucholke, Dominik Hanisch, Christoph Schmid, Paul Julius Ritter, Marius Neumann, Edward Goldobin, Dieter Koelle, Reinhold Kleiner, Meinhard Schilling, Benedikt Hampel

Abstract

Fabrication of YBa2Cu3O7-x Josephson junctions (JJs) using a direct-write helium-focused helium ion beam (He-FIB) technique has great potential for various applications due to tunable JJ parameters and arbitrary positioning. This technique allows placing multiple JJs in series to create JJ arrays. They could be used as a voltage standard that is operated at higher temperatures and driving frequencies than the currently used niobium-based JJ arrays. Small YBa2Cu3O7-x He-FIB JJ arrays with superposed Shapiro steps for up to three JJs have already been demonstrated. The number of JJs in the array was limited by the parameter spread of the individual JJs. This study presents WRspice simulations of JJ arrays, which indicate that the normal state resistance Rn is the most crucial parameter to achieve flat Shapiro steps in JJ arrays. The idea of adding a shunt resistor to the JJ array to deal with the spread in Rn values is investigated. A new design for GHz frequencies is presented, and the fabrication process is described. The properties of the shunt resistor are evaluated by van der Pauw measurements. Comparison of measurements with and without shunt resistor shows the desired effect of changing the total resistance of the JJ array while maintaining the critical current value. Finally, measurements of JJ arrays demonstrating superposed Shapiro steps at 20 k at GHz frequencies are presented.

Details

Externe Organisation(en)
Technische Universität Braunschweig
Eberhard Karls Universität Tübingen
Typ
Artikel
Journal
IEEE Transactions on Applied Superconductivity
Band
36
ISSN
1051-8223
Publikationsdatum
26.01.2026
Publikationsstatus
Veröffentlicht
Peer-reviewed
Ja
ASJC Scopus Sachgebiete
Elektronische, optische und magnetische Materialien, Physik der kondensierten Materie, Elektrotechnik und Elektronik
Elektronische Version(en)
https://doi.org/10.1109/TASC.2025.3644143 (Zugang: Unbekannt )

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