The fully coupled thermo-mechanical dual-horizon peridynamic correspondence damage model for homogeneous and heterogeneous materials

verfasst von: Yehui Bie, Huilong Ren, Timon Rabczuk, Tinh Quoc Bui, Yueguang Wei
Abstract: To accurately address the thermally induced dynamic and steady-state crack propagation problems for homogeneous and heterogeneous materials involving crack branching, interfacial de-bonding and crack kinking, we propose the fully coupled thermo-mechanical dual-horizon peridynamic correspondence damage model (TM-DHPD). To this end, the integral coupled equations for TM-DHPD are firstly derived within the framework of thermodynamics. And then, the alternative dual-horizon peridynamic correspondence principle is used to derive the constitutive bond force state, heat flow state and their general linearizations. Moreover, the unified criterion for bond damage is proposed to characterize the internal bond damage in a single material and the interface bond damage in dissimilar materials. To ensure convergence and accuracy, the coupled equations are solved using the standard implicit method without the use of artificial damping. In both homogeneous and heterogeneous materials, some representative and challenging numerical cases are examined, such as dynamic crack branching in a centrally heated disk and multiple interface failure of thermal barrier coating. The numerical results are in good agreement with the available experimental results or the previous predictions, which shows the great potential of the proposed TM-DHPD in addressing the physics of numerous thermally induced fractures in the real-world engineering problems.
Organisationseinheit(en): Institut für Photonik
Externe Organisation(en): Peking University
Bauhaus-Universität Weimar
Duy Tan University
Typ: Artikel
Journal: Computer Methods in Applied Mechanics and Engineering
Band: 420
Anzahl der Seiten: 30
ISSN: 0045-7825
Publikationsdatum: 15.02.2024
Publikationsstatus: Veröffentlicht
Peer-reviewed: Ja
ASJC Scopus Sachgebiete: Numerische Mechanik, Werkstoffmechanik, Maschinenbau, Physik und Astronomie (insg.), Angewandte Informatik
Elektronische Version(en): https://doi.org/10.1016/j.cma.2023.116730 (Zugang: Geschlossen)

BibTeX

@article{a4de0a46a13c447da449895cdd9a8bf6,
title = "The fully coupled thermo-mechanical dual-horizon peridynamic correspondence damage model for homogeneous and heterogeneous materials",
abstract = "To accurately address the thermally induced dynamic and steady-state crack propagation problems for homogeneous and heterogeneous materials involving crack branching, interfacial de-bonding and crack kinking, we propose the fully coupled thermo-mechanical dual-horizon peridynamic correspondence damage model (TM-DHPD). To this end, the integral coupled equations for TM-DHPD are firstly derived within the framework of thermodynamics. And then, the alternative dual-horizon peridynamic correspondence principle is used to derive the constitutive bond force state, heat flow state and their general linearizations. Moreover, the unified criterion for bond damage is proposed to characterize the internal bond damage in a single material and the interface bond damage in dissimilar materials. To ensure convergence and accuracy, the coupled equations are solved using the standard implicit method without the use of artificial damping. In both homogeneous and heterogeneous materials, some representative and challenging numerical cases are examined, such as dynamic crack branching in a centrally heated disk and multiple interface failure of thermal barrier coating. The numerical results are in good agreement with the available experimental results or the previous predictions, which shows the great potential of the proposed TM-DHPD in addressing the physics of numerous thermally induced fractures in the real-world engineering problems.",
keywords = "Crack branching, Heterogeneous materials, Interfacial de-bonding, Peridynamics, Thermally induced fractures",
author = "Yehui Bie and Huilong Ren and Timon Rabczuk and {Quoc Bui}, Tinh and Yueguang Wei",
note = "Funding Information: This work is supported by the National Natural Science Foundation of China (Grant nos. 11890681, 12032001 and 11521202 ). ",
year = "2024",
month = feb,
day = "15",
doi = "10.1016/j.cma.2023.116730",
language = "English",
volume = "420",
journal = "Computer Methods in Applied Mechanics and Engineering",
issn = "0045-7825",
publisher = "Elsevier",
}